Title:
METHOD AND VEHICLE FOR DIVIDING SUBSTRATE HAVING DEVICE FORMED THEREON INTO INDIVIDUAL CHIPS
Document Type and Number:
WIPO Patent Application WO/2019/093133
Kind Code:
A1
Abstract:
Provided is a dicing method with which it is possible to obtain a high yield even when a chip is cut with a narrow width. Provided is a method of dividing a substrate having a device formed thereon into individual chips. The methods include: a step of supplying a process liquid including an oxidizing agent and an alkaline agent to a back surface of the substrate on which the device is not formed; a step of processing, while the process liquid is being supplied, the substrate from the back surface of the substrate along a dividing planned line; and a step of processing the substrate along the dividing planned line from the surface of the substrate on which the device is formed.
Inventors:
FUKUNAGA AKIRA (JP)
TSUJIMURA MANABU (JP)
TSUJIMURA MANABU (JP)
Application Number:
PCT/JP2018/039580
Publication Date:
May 16, 2019
Filing Date:
October 25, 2018
Export Citation:
Assignee:
EBARA CORP (JP)
International Classes:
H01L21/301; B23K26/364; B24B27/06; B24B57/02; H01L21/304
Foreign References:
| JP2015177089A | 2015-10-05 | |||
| JP2011159679A | 2011-08-18 | |||
| JP2017034129A | 2017-02-09 | |||
| JP2014003216A | 2014-01-09 | |||
| JP2007165371A | 2007-06-28 |
Attorney, Agent or Firm:
ONO, Shinjiro et al. (JP)
Download PDF:
Previous Patent: SIGNAL DETECTING SYSTEM
Next Patent: GAS SEPARATION DEVICE AND GAS SEPARATION METHOD
Next Patent: GAS SEPARATION DEVICE AND GAS SEPARATION METHOD