Title:
METHODS AND APPARATUS FOR MAKING INTEGRATED CIRCUIT PACKAGE INCLUDING OPENING EXPOSING PORTION OF THE IC
Document Type and Number:
WIPO Patent Application WO2002015209
Kind Code:
A3
Abstract:
A method for making an IC package preferably includes providing a mold including first and second mold portions, and wherein the first mold portion carries a mold protrusion defining an IC-contact surface with peripheral edges and a bleed-through retention channel positioned inwardly from the peripheral edges. The method also preferably includes closing the first and second mold portions around the IC and injecting encapsulating material into the mold to encapsulate the IC and make the IC package having an exposed portion of the IC adjacent the mold protrusion. Morever, the bleed-through retention channel retains any encapsulating material bleeding beneath the peripheral edges of the IC contact surface, and prevents the encapsulating material from reaching further onto the exposed portion of the IC. The method may also include releasing the IC package with the exposed portion of the IC. The method may also include releasing the IC package with the exposed portion from the mold.
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Inventors:
SALATINO MATTHEW M (US)
WEBER PATRICK O (US)
WEBER PATRICK O (US)
Application Number:
PCT/US2001/025614
Publication Date:
July 24, 2003
Filing Date:
August 16, 2001
Export Citation:
Assignee:
AUTHENTEC INC (US)
SALATINO MATTHEW M (US)
WEBER PATRICK O (US)
SALATINO MATTHEW M (US)
WEBER PATRICK O (US)
International Classes:
G06K9/00; H01L21/56; H01L23/31; (IPC1-7): H01L23/31; H01L21/56; G06K9/00
Foreign References:
| US5644169A | 1997-07-01 | |||
| EP0724294A2 | 1996-07-31 | |||
| US5927505A | 1999-07-27 | |||
| US5862248A | 1999-01-19 |
Other References:
PATENT ABSTRACTS OF JAPAN vol. 013, no. 366 (E - 806) 15 August 1989 (1989-08-15)
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