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Title:
METHODS OF AND APPARATUS FOR MOLDING STRUCTURES
Document Type and Number:
WIPO Patent Application WO2003095708
Kind Code:
A3
Abstract:
Molded structures, methods of and apparatus for producing the molded structures are provided. At least a portion of the surface features for the molds are formed from multilayer electrochemically fabricated structures (e.g. fabricated by the EFAB formation process), and typically contain features having resolutions within the 1 to 100 µm range. The layered structure is combined with other mold components, as necessary, and a molding material is injected into the mold and iohardened. The layered structure is removed (e.g. by etching) along with any other mold components to yield the molded article. In some embodiments portions of the layered structure remain in the molded article and in other embodiments an additional molding material is added after a partial or complete removal of the layered structure.

Inventors:
BANG CHRISTOPHER A
Application Number:
PCT/US2003/014662
Publication Date:
August 18, 2005
Filing Date:
May 07, 2003
Export Citation:
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Assignee:
MEMGEN CORP (US)
International Classes:
B81B3/00; B81C1/00; C25D1/10; C25D5/02; G01P15/08; G01P15/125; (IPC1-7): C25D1/00
Foreign References:
US20010014409A12001-08-16
US6346030B12002-02-12
US5685491A1997-11-11
US5622611A1997-04-22
US6280832B12001-08-28
US6355147B12002-03-12
Other References:
COHEN A ET AL: "EFAB: rapid, low-cost desktop micromachining of high aspect ratio true 3-D MEMS", MICRO ELECTRO MECHANICAL SYSTEMS, 1999. MEMS '99. TWELFTH IEEE INTERNATIONAL CONFERENCE ON ORLANDO, FL, USA 17-21 JAN. 1999, PISCATAWAY, NJ, USA,IEEE, US, 17 January 1999 (1999-01-17), pages 244 - 251, XP010321754, ISBN: 0-7803-5194-0
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