Title:
METHODS FOR CONTROLLING PHYSICAL VAPOR DEPOSITION METAL FILM ADHESION TO SUBSTRATES AND SURFACES
Document Type and Number:
WIPO Patent Application WO/2019/157106
Kind Code:
A3
Abstract:
A method of depositing of a film on a substrate with controlled adhesion. The method comprises depositing the film including metal, wherein the metal is deposited on the substrate using physical vapor deposition at a pressure that achieves a pre-determined adhesion of the film to the substrate. The pre-determined adhesion allows processing of the film into a device while the film is adhered to the substrate but also allows removal of the device from the substrate.
Inventors:
SRINIVASAN AKHIL (US)
WANG YIFEI (US)
WANG YIFEI (US)
Application Number:
PCT/US2019/016926
Publication Date:
October 10, 2019
Filing Date:
February 06, 2019
Export Citation:
Assignee:
MEDTRONIC MINIMED INC (US)
International Classes:
C23C14/00; A61B5/145; C23C14/02; C23C14/18; C23C14/34
Foreign References:
| US20070227907A1 | 2007-10-04 | |||
| US20110152654A1 | 2011-06-23 | |||
| US20120190950A1 | 2012-07-26 | |||
| US20080026473A1 | 2008-01-31 | |||
| US20180325430A1 | 2018-11-15 |
Other References:
GULATI R ET AL: "IMPROVED METAL-DIELECTRIC ADHESION FOR INTERCONNECT LINES OF MMICS AND ICS: AN EXPERIMENTAL STUDY", MATERIALS SCIENCE AND ENGINEERING: B, ELSEVIER, AMSTERDAM, NL, vol. B28, no. 1/03, 1 December 1994 (1994-12-01), pages 357 - 360, XP000513309, ISSN: 0921-5107, DOI: 10.1016/0921-5107(94)90082-5
Attorney, Agent or Firm:
SERAPIGLIA, Gerard B. (US)
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