Title:
METHODS FOR MANUFACTURING FORMING DIE, WAFER LENS, AND OPTICAL LENS
Document Type and Number:
WIPO Patent Application WO/2012/121221
Kind Code:
A1
Abstract:
By making the amount of resin for forming each first-stage resin layer portion (first-stage resin replica part) (41da) in a first step larger than the amount of resin for forming each second-stage resin layer portion (second-stage resin replica part) (41db) in a second step, a connection part (48) in which resins overlap each other is formed at the boundary between the first-stage resin layer portion (41da) and the second-stage resin layer portion (41db), and thus the occurrence of an undercut shape can be prevented. Consequently, in a forming step using a sub master die (40) and a sub sub-master die (50) obtained therefrom, the occurrence of an unintended shape can be prevented, and demolding resistance can be reduced or eliminated.
Inventors:
FURUTA KATSUKI (JP)
MATSUDA HIROYUKI (JP)
MATSUDA HIROYUKI (JP)
Application Number:
PCT/JP2012/055589
Publication Date:
September 13, 2012
Filing Date:
March 05, 2012
Export Citation:
Assignee:
KONICA MINOLTA OPTO INC (JP)
FURUTA KATSUKI (JP)
MATSUDA HIROYUKI (JP)
FURUTA KATSUKI (JP)
MATSUDA HIROYUKI (JP)
International Classes:
B29C33/38; B29C39/10; B29C43/36; G02B3/00; B29L11/00
Foreign References:
| JP2010102312A | 2010-05-06 | |||
| JP2010266667A | 2010-11-25 | |||
| JP2010191001A | 2010-09-02 | |||
| JP2011013577A | 2011-01-20 |
Attorney, Agent or Firm:
FUKUDA, MITSUHIRO (JP)
Mitsuhiro Fukuda (JP)
Mitsuhiro Fukuda (JP)
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Claims: