Title:
METHODS FOR MANUFACTURING LAMINATED PLATE AND HEAT GENERATOR, AND DEFROSTER
Document Type and Number:
WIPO Patent Application WO/2022/176699
Kind Code:
A1
Abstract:
Provided is a method for manufacturing a laminated plate that, although a polyvinyl acetal resin having a low reactivity with respect to a copper foil is used therein, provides excellent adhesion between the copper foil and a resin film. Said method comprises: a step for preparing a copper foil that has, at least on one side thereof, a treated surface in which the nitrogen amount is 3.0-20.0 atom %; and a step for forming a laminated plate by forming or joining a polyvinyl acetal resin film on or to the treated surface of the copper foil. Said nitrogen amount is the proportion of N in the total amount of N, O, Si, P, S, Cl, Cr, Ni, Cu, Zn, Mo, Co, W, and Fe when elemental analysis is performed on the treated surface using X-ray photoelectron spectroscopy (XPS).
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Inventors:
HOSOKAWA MAKOTO (JP)
SHIMIZU TOSHIYUKI (JP)
SHIMIZU TOSHIYUKI (JP)
Application Number:
PCT/JP2022/004843
Publication Date:
August 25, 2022
Filing Date:
February 08, 2022
Export Citation:
Assignee:
MITSUI MINING & SMELTING CO LTD (JP)
International Classes:
B32B15/082; H05B3/20; H05B3/86
Domestic Patent References:
| WO2014024994A1 | 2014-02-13 | |||
| WO2017090386A1 | 2017-06-01 |
Foreign References:
| JP2011014727A | 2011-01-20 | |||
| JP2015193884A | 2015-11-05 | |||
| JP4354271B2 | 2009-10-28 | |||
| JP2006218855A | 2006-08-24 | |||
| JP2006159900A | 2006-06-22 | |||
| JPH1110794A | 1999-01-19 | |||
| JP2018035036A | 2018-03-08 | |||
| JP2018161889A | 2018-10-18 | |||
| JP2019142763A | 2019-08-29 | |||
| JP2015193884A | 2015-11-05 | |||
| JP4354271B2 | 2009-10-28 |
Attorney, Agent or Firm:
TAKAMURA Masaharu et al. (JP)
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