Title:
METHODS FOR METAL PLATING AND RELATED DEVICES
Document Type and Number:
WIPO Patent Application WO/2012/082956
Kind Code:
A3
Abstract:
Methods for plating metal over features of a semiconductor wafer and devices that can be formed by these methods are disclosed. One such method includes forming a barrier layer over the substrate using electroless plating and forming a copper layer over the barrier layer. In some implementations, the semiconductor wafer is a GaAs wafer. Alternatively or additionally, the feature over which metal is plated can be a through-wafer via. In some implementations, a seed layer over the barrier layer can be formed using electroless plating.
Inventors:
SHEN HONG (US)
Application Number:
PCT/US2011/064997
Publication Date:
October 11, 2012
Filing Date:
December 14, 2011
Export Citation:
Assignee:
SKYWORKS SOLUTIONS INC (US)
SHEN HONG (US)
SHEN HONG (US)
International Classes:
H01L21/28
Domestic Patent References:
| WO2009142655A1 | 2009-11-26 |
Foreign References:
| US6939800B1 | 2005-09-06 | |||
| US20100078818A1 | 2010-04-01 | |||
| US20090045514A1 | 2009-02-19 |
Attorney, Agent or Firm:
ALTMAN, Daniel, E. (LLP2040 Main Street,Fourteenth Floo, Irvine CA, US)
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