Title:
METHODS AND SYSTEMS FOR CONDITIONING SLOTTED SUBSTRATES
Document Type and Number:
WIPO Patent Application WO2005016649
Kind Code:
A3
Abstract:
The described embodiments relate to slotted substrates. One exemplary method removes substrate material (406) from a substrate (300) to form a fluid-handling slot (305) through the substrate (300). This particular method also mechanically conditions the substrate (300) proximate the fluid-handling slot (305), at least in part, to remove debris (500) created by the removing.
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Inventors:
HORN BARBARA (US)
KIRBY KEITH (US)
HOLMES SAM (US)
KHAVARI MEHGRAN (US)
RIVAS RIO (US)
TRUNK GERALD G (US)
BERGSTROM DEANNA J (US)
PHAM CHON (US)
KIRBY KEITH (US)
HOLMES SAM (US)
KHAVARI MEHGRAN (US)
RIVAS RIO (US)
TRUNK GERALD G (US)
BERGSTROM DEANNA J (US)
PHAM CHON (US)
Application Number:
PCT/US2004/025745
Publication Date:
May 12, 2005
Filing Date:
August 09, 2004
Export Citation:
Assignee:
HEWLETT PACKARD DEVELOPMENT CO (US)
HORN BARBARA (US)
KIRBY KEITH (US)
HOLMES SAM (US)
KHAVARI MEHGRAN (US)
RIVAS RIO (US)
TRUNK GERALD G (US)
BERGSTROM DEANNA J (US)
PHAM CHON (US)
HORN BARBARA (US)
KIRBY KEITH (US)
HOLMES SAM (US)
KHAVARI MEHGRAN (US)
RIVAS RIO (US)
TRUNK GERALD G (US)
BERGSTROM DEANNA J (US)
PHAM CHON (US)
International Classes:
B41J2/16; (IPC1-7): B41J2/16
Foreign References:
US3867217A | 1975-02-18 | |||
US20030140497A1 | 2003-07-31 | |||
EP1287994A2 | 2003-03-05 |
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