Title:
MICRO-ELECTROMECHANICAL CHIP
Document Type and Number:
WIPO Patent Application WO/2024/067243
Kind Code:
A1
Abstract:
A micro-electromechanical chip, comprising a substrate (1), a support structure layer (2), a diaphragm layer (3), and a back electrode layer (4). Cavities (5) are provided in the middle of the substrate (1) and in the middle of the support structure layer (2); the diaphragm layer (3) comprises an inner membrane (31), and a connecting shank (32) connected to the inner membrane (31); the inner membrane (31) and the back electrode layer (4) are both opposite the cavities (5), an airflow hole (33) is provided between the outside of the inner membrane (31) and of the connecting shank (32) and the support structure layer (2), and a top end of the connecting shank (32) is connected to the support structure layer (2); and a limiting protrusion (6) is provided on an inside surface of the airflow hole (33). By providing the limiting protrusion (6), tremor shaking and displacement of the inner membrane (31) are reduced, so as to reduce the risk of breakage of the connecting shank (32) due to the tremor shaking of the inner membrane (31).
Inventors:
SU ZHIYAN (CN)
QIU GUANXUN (CN)
LIN YUANSHAO (CN)
QIU GUANXUN (CN)
LIN YUANSHAO (CN)
Application Number:
PCT/CN2023/119651
Publication Date:
April 04, 2024
Filing Date:
September 19, 2023
Export Citation:
Assignee:
GOERTEK MICROELECTRONICS INC (CN)
International Classes:
H04R1/08; H04R19/04
Attorney, Agent or Firm:
BEYOND TALENT PATENT AGENT FIRM (CN)
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