Title:
MICRO-FLUIDIC SUBSTRATE, MICRO-FLUIDIC CHIP AND ANALYSIS APPARATUS
Document Type and Number:
WIPO Patent Application WO/2024/021005
Kind Code:
A1
Abstract:
A micro-fluidic substrate, a micro-fluidic chip and an analysis apparatus. The micro-fluidic substrate comprises: a base substrate (100) and a conductive layer (200), which is arranged on the base substrate (100), patterns of the conductive layer (200) comprising an electrode pattern (210) and a wiring pattern (220), wherein the orthographic projection of at least part of the wiring pattern (220) on the base substrate (100) passes through one side of the orthographic projection of the electrode pattern (210) on the base substrate (100), and has a minimum distance of greater than or equal to 4 micrometers from an outer contour of the electrode pattern (210). By means of the provided micro-fluidic substrate, micro-fluidic chip and analysis apparatus, the phenomenon of device failure caused by static electricity can be ameliorated, and the chip reliability can be improved.
Inventors:
FAN BOLIN (CN)
GU LE (CN)
GAO YONGJIA (CN)
ZHAO YINGYING (CN)
YANG LI (CN)
LIU HUAZHE (CN)
GU LE (CN)
GAO YONGJIA (CN)
ZHAO YINGYING (CN)
YANG LI (CN)
LIU HUAZHE (CN)
Application Number:
PCT/CN2022/108894
Publication Date:
February 01, 2024
Filing Date:
July 29, 2022
Export Citation:
Assignee:
BOE TECHNOLOGY GROUP CO LTD (CN)
BEIJING BOE SENSOR TECH CO LTD (CN)
BEIJING BOE SENSOR TECH CO LTD (CN)
International Classes:
B01L3/00
Domestic Patent References:
| WO2021077230A1 | 2021-04-29 | |||
| WO2022134064A1 | 2022-06-30 |
Foreign References:
| CN107904163A | 2018-04-13 | |||
| CN112007703A | 2020-12-01 |
Other References:
YONGFU MA, WANG LILI; JIANG LING; CHEN YAO; LI ZIBIN: "Influences of High Altitudes Conditions on the Electric Field and Insulation of Equipment", QINGHAI ELECTRIC POWER, vol. 39, no. 2, 30 June 2020 (2020-06-30), pages 25 - 30, 54, XP093133510
Attorney, Agent or Firm:
DRAGON INTELLECTUAL PROPERTY LAW FIRM (CN)
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