Title:
MICRO-LED CHIP REWORK DEVICE AND REWORK METHOD USING TRANSFER METHOD
Document Type and Number:
WIPO Patent Application WO/2023/027387
Kind Code:
A1
Abstract:
A micro-LED chip rework device using a transfer method, according to the present invention, removes a misaligned micro-LED chip or a defective micro-LED chip having deficient performance from a plurality of micro-LED chips transferred by means of a first adhesive layer on a substrate, the device comprising: a detachable pressurization head, which has a stick form and is pressed at the upper surface of the defective micro-LED chip when a second adhesive layer having an adhesive strength greater than that of the first adhesive layer is provided at the lower end of the stick shape, so that the defective micro-LED chip attached onto the first adhesive layer is transferred onto the second adhesive layer and removed; and a driving unit, which moves the detachable pressurization head in X-, Y- and Z-axial directions on the substrate.
Inventors:
CHOI JAE JOON (KR)
KIM BYUNG ROC (KR)
KIM BYUNG ROC (KR)
Application Number:
PCT/KR2022/011912
Publication Date:
March 02, 2023
Filing Date:
August 10, 2022
Export Citation:
Assignee:
LASERSSEL CO LTD (KR)
International Classes:
H01L21/67; H01L21/52; H01L21/677; H01L25/075; H05K13/04
Domestic Patent References:
| WO2021125775A1 | 2021-06-24 |
Foreign References:
| KR101890934B1 | 2018-08-22 | |||
| US20210050271A1 | 2021-02-18 | |||
| JP2020181910A | 2020-11-05 | |||
| KR20200012356A | 2020-02-05 | |||
| KR101879029B1 | 2018-07-16 | |||
| KR102130124B1 | 2020-07-03 | |||
| KR101937071B1 | 2019-01-09 | |||
| KR20200109493A | 2020-09-23 |
Attorney, Agent or Firm:
NAM, Jung Hoon (KR)
Download PDF: