Title:
MICRO LED VERIFICATION SUBSTRATE, MANUFACTURING METHOD THEREFOR, AND MICRO LED VERIFICATION METHOD USING SAME
Document Type and Number:
WIPO Patent Application WO/2019/190102
Kind Code:
A1
Abstract:
Disclosed in the present specification are an apparatus and a method capable of quickly verifying a plurality of micro LEDs. An LED verification substrate according to the present specification is a micro LED verification substrate having a plurality of verification chips, wherein each verification chip can comprise: a first contact deposited on the upper side of a lower substrate; a first passivation layer deposited on the upper side of the first contact; a second contact deposited on the upper side of the first passivation layer; a second passivation layer deposited on the upper side of the second contact; a first bump electrically connected to the first contact and protruding above the upper surface of the second passivation layer; and a second bump electrically connected to the second contact and protruding above the upper surface of the second passivation layer.
Inventors:
PARK SI HYUN (KR)
LEE YOUNG WOONG (KR)
LEE YOUNG WOONG (KR)
Application Number:
PCT/KR2019/003119
Publication Date:
October 03, 2019
Filing Date:
March 19, 2019
Export Citation:
Assignee:
UNIV YEUNGNAM RES COOPERATION FOUNDATION (KR)
International Classes:
H01L33/00; H01L25/075
Domestic Patent References:
| WO2017037475A1 | 2017-03-09 |
Foreign References:
| JP2004245669A | 2004-09-02 | |||
| KR20120020857A | 2012-03-08 | |||
| US20030011377A1 | 2003-01-16 | |||
| US6301121B1 | 2001-10-09 |
Attorney, Agent or Firm:
TNI IP LAW FIRM (KR)
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