MICRO-PROCESSING DEVICE AND METHOD USING LASER

WIPO Patent Application WO/2024/019452

A1

The present invention relates to a micro-processing device and method using a laser, the device comprising: a laser beam emission unit for forming a processed hole by emitting a laser beam at a crystallized object to be processed through which the laser beam passes; an optical unit for adjusting the shape of the laser beam so as to locally emit the laser beam at the inside of the object to be processed, thereby de-crystallizing the crystallized object to be processed; a laser beam adjustment unit for adjusting the pulse width and the pulse energy of the laser beam; and a chemical reactor for chemically removing, through a chemical reaction, the processed hole formed in a non-crystallized area of the object to be processed that is precipitated in a reaction solution accommodated inside the chemical reactor, wherein the processed hole is processed such that the thickness of the object to be processed is several times to tens of thousand times proportionally greater than the diameter of the processed hole, and thus an ultra-micro three-dimensional shape and a very narrow hole in which the thickness of the object to be processed is several times to tens of thousand times proportionally greater than the diameter of the processed hole can be formed inside the crystallized object to be processed while cracks or damage to the object to be processed is minimized.

LEE SEAK JOON (KR)

PCT/KR2023/010193

January 25, 2024

July 17, 2023

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ITI CO LTD (KR)

B23K26/382; B23K26/0622; B23K26/064; B23K103/00

KR101165084B1	2012-07-12
KR20180048891A	2018-05-10
JP2016049542A	2016-04-11
KR20160118091A	2016-10-11
KR20220071975A	2022-05-31
KR102459645B1	2022-10-28

WELL PATENT LAW FIRM (KR)

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