Title:
MICRO-RELIEF STRUCTURE ELEMENT
Document Type and Number:
WIPO Patent Application WO/2016/006627
Kind Code:
A1
Abstract:
A micro-relief structure element having a micro-relief structure on a surface thereof, the micro-relief structure comprising a cured material of an active-energy-ray-curable composition and having a plurality of protrusions in which the interval between adjacent protrusions is 50 nm to 400 nm, the aspect ratio of the protrusions being 0.6 to 1.5, the elastic modulus at 25°C of the cured material forming the micro-relief structure being 15 to 140 MPa, and the ratio (A1/A2) of a peak area A1 having an absorption maximum in the region of 3700 to 3100 cm-1 and a peak area A2 having an absorption maximum in the region of 3100 to 2700 cm-1 of the infrared absorption spectrum of the surface of the cured material having the plurality of protrusions being 0.01 to 0.35.
Inventors:
ONOMOTO HIROSHI (JP)
TAKIHARA TSUYOSHI (JP)
OKAMOTO EIKO (JP)
TAKIHARA TSUYOSHI (JP)
OKAMOTO EIKO (JP)
Application Number:
PCT/JP2015/069629
Publication Date:
January 14, 2016
Filing Date:
July 08, 2015
Export Citation:
Assignee:
MITSUBISHI RAYON CO (JP)
International Classes:
C08L101/12; B29C59/02; C08F2/46; C08J7/043; C08J7/044; C08J7/046; C08L83/04; G02B1/118
Domestic Patent References:
| WO2013187528A1 | 2013-12-19 | |||
| WO2013187506A1 | 2013-12-19 |
Foreign References:
| JP2012139899A | 2012-07-26 | |||
| JP2013228729A | 2013-11-07 | |||
| JP2013160954A | 2013-08-19 |
Attorney, Agent or Firm:
SHIGA Masatake et al. (JP)
Masatake Shiga (JP)
Masatake Shiga (JP)
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