Title:
MICROCAPSULE TYPE CURABLE RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2023/090026
Kind Code:
A1
Abstract:
The present invention provides a microcapsule type curable resin composition which is applied to a screw member so as to reduce the generation of dust when the screw member is screwed into a base material, while additionally having excellent loosening prevention effect. The present invention also provides a method for producing a screw member, the method having a step in which a precoat adhesive layer is formed by applying the above-described microcapsule type curable resin composition to the surface of a screw member and drying the curable resin composition thereon. The present invention also provides a screw member which has a precoat adhesive layer that is formed by applying the above-described microcapsule type curable resin composition to the surface of the screw member and drying the curable resin composition thereon. The present invention provides a microcapsule type curable resin composition which contains the components (A) to (D) described below. Component (A): an epoxy resin
Component (B): a water-dispersible binder
Component (C): a curing agent for epoxy resins
Component (D): a hollow filler
Inventors:
SOGA TETSUNORI (JP)
Application Number:
PCT/JP2022/038682
Publication Date:
May 25, 2023
Filing Date:
October 18, 2022
Export Citation:
Assignee:
THREE BOND CO LTD (JP)
International Classes:
C08L63/00; C08G59/66; C08K5/17; C08K5/37; C09J11/00; C09J11/06; C09J133/04; C09J163/00; C09J201/00; F16B39/02
Domestic Patent References:
| WO2010150818A1 | 2010-12-29 | |||
| WO2009107861A1 | 2009-09-03 | |||
| WO2017057019A1 | 2017-04-06 | |||
| WO2015045830A1 | 2015-04-02 | |||
| WO2015064323A1 | 2015-05-07 |
Foreign References:
| JP2008156383A | 2008-07-10 | |||
| JPH0742719A | 1995-02-10 | |||
| JP2001064481A | 2001-03-13 | |||
| JP2003194032A | 2003-07-09 | |||
| JPH09241351A | 1997-09-16 |
Attorney, Agent or Firm:
HATTA & ASSOCIATES (JP)
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