Title:
MICROCHIP
Document Type and Number:
WIPO Patent Application WO/2021/039296
Kind Code:
A1
Abstract:
Provided is a microchip that effectively prevents separation of a laminated bonding substrate and is not liable to cause leakage. The microchip comprises a plurality of substrates each having a principal surface and a lateral surface. The plurality of substrates form a bonding substrate with the principal surfaces thereof laminated with each other, and a micro flow path is provided inside the bonding substrate. The plurality of substrates include a first substrate having a large thickness and a remaining substrate having a thickness smaller than that of the first substrate. When one end of the bonding substrate is seen from a direction parallel to the principal surfaces, the lateral surface of at least the first substrate has an inclination and extends to the outermost side.
Inventors:
SHIMONAKA MASATOSHI (JP)
Application Number:
PCT/JP2020/029651
Publication Date:
March 04, 2021
Filing Date:
August 03, 2020
Export Citation:
Assignee:
USHIO ELECTRIC INC (JP)
International Classes:
B29C45/37; B81B1/00; C12M1/00; G01N37/00
Domestic Patent References:
| WO2009125757A1 | 2009-10-15 | |||
| WO2019082471A1 | 2019-05-02 | |||
| WO2018012276A1 | 2018-01-18 | |||
| WO2009101845A1 | 2009-08-20 |
Foreign References:
| JP2017524906A | 2017-08-31 | |||
| JP2018047614A | 2018-03-29 |
Other References:
OGAWA, KEIJI: "Aiming to established advanced production processing technology and systems", RYUKOKU JOURNAL OF SICENCE AND TECHNOLOGY, vol. 26, no. 2, 30 November 2013 (2013-11-30), JP, pages 10 - 16, XP009534554
Attorney, Agent or Firm:
UNIUS PATENT ATTORNEYS OFFICE (JP)
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