Title:
MICROELECTROMECHANICAL SYSTEMS MICROPHONE CHIP
Document Type and Number:
WIPO Patent Application WO/2021/189585
Kind Code:
A1
Abstract:
The present utility model provides a microelectromechanical systems microphone chip, comprising a substrate having a back cavity, and a back electrode plate and a diaphragm which are respectively supported and fixed on the substrate, mutually insulated and spaced apart, the diaphragm being positioned between the substrate and the back electrode plate, and respectively spaced apart from the substrate and the back electrode plate. The substrate comprises a top surface facing the diaphragm, a bottom surface arranged opposite the top surface, and an inner side surface which connects the top surface and the bottom surface and faces the back cavity. The diaphragm is fixed on the top surface, the back electrode plate is fixed on the side of the diaphragm away from the top surface, and the junction between the inner side surface and the top surface is arranged as a chamfered structure or a fillet structure. Compared with the related art, the microelectromechanical systems microphone chip provided in the present utility model has a lower risk of diaphragm fracture and has a longer service life.
Inventors:
BAI YANG (CN)
Application Number:
PCT/CN2020/086337
Publication Date:
September 30, 2021
Filing Date:
April 23, 2020
Export Citation:
Assignee:
AAC ACOUSTIC TECH SHENZHEN CO LTD (CN)
International Classes:
H04R19/00; H04R1/08; H04R7/02
Foreign References:
| CN206024109U | 2017-03-15 | |||
| CN110582046A | 2019-12-17 | |||
| CN107690114A | 2018-02-13 | |||
| CN107666645A | 2018-02-06 | |||
| CN207053775U | 2018-02-27 | |||
| US10390145B1 | 2019-08-20 | |||
| CN205754849U | 2016-11-30 | |||
| US20150245123A1 | 2015-08-27 |
Attorney, Agent or Firm:
SHENZHEN JUNXINCHENG INTELLECTUAL PROPERTY FIRM (GENERAL PARTNERSHIP) (CN)
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