Title:
MICROETCHING AGENT FOR COPPER, REPLENISHMENT SOLUTION THEREOF, AND METHOD FOR PRODUCING WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2014/017115
Kind Code:
A1
Abstract:
Provided are: a microetching agent; a replenishment solution for the microetching agent; and a method for producing a wiring board using the microetching agent. A microetching agent of the present invention is composed of an aqueous solution that contains cupric ions, an organic acid, halide ions, an amino group-containing compound having a molecular weight of 17-400, and a polymer. The polymer is a water-soluble polymer that has a polyamine chain and/or a cationic group, while having a weight average molecular weight of 1,000 or more. With respect to this microetching agent, if A (wt%) is the concentration of the amino group-containing compound and B (wt%) is the concentration of the polymer, the value of A/B is 50-6,000. According to the present invention, adhesion between copper and a resin or the like can be maintained even if the amount of etching is small.
Inventors:
KURII MASAYO (JP)
TAI KIYOTO (JP)
NAKAMURA MAMI (JP)
TAI KIYOTO (JP)
NAKAMURA MAMI (JP)
Application Number:
PCT/JP2013/055843
Publication Date:
January 30, 2014
Filing Date:
March 04, 2013
Export Citation:
Assignee:
MEC CO LTD (JP)
International Classes:
C23F1/18; H05K3/38
Foreign References:
| JPH0941162A | 1997-02-10 | |||
| JPH0941162A | 1997-02-10 | |||
| JPH0941163A | 1997-02-10 | |||
| US3645772A | 1972-02-29 |
Other References:
See also references of EP 2878705A4
Attorney, Agent or Firm:
SHINTAKU, Masato et al. (JP)
Masahito Shintaku (JP)
Masahito Shintaku (JP)
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