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Title:
MICROFLUIDIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2021/261200
Kind Code:
A1
Abstract:
The present invention provides a microfluidic device that can efficiently heat fluid therein while utilizing the advantage of being a micro-scale device, for example, achieving a reduction in size of a device.　A microfluidic device according to the present invention is a laminate (18) including a conductor layer (13) and a pair of insulator layers (11, 12) arranged on both sides of the conductor layer (13). The conductor layer (13) is provided with a groove-like flow path section (14) extending along a surface of the conductor layer (13) and through which the fluid flows.

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Inventors:
KOMORI TAKAYUKI (JP)
Application Number:
PCT/JP2021/021152
Publication Date:
December 30, 2021
Filing Date:
June 03, 2021
Export Citation:
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Assignee:
NOK CORP (JP)
International Classes:
B01J19/00; B81B1/00; G01N37/00
Domestic Patent References:
WO2004082823A12004-09-30
Foreign References:
JP2012016811A2012-01-26
JP2004256387A2004-09-16
JP2005305234A2005-11-04
Attorney, Agent or Firm:
EINSEL Felix-Reinhard et al. (JP)
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