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Patent Searching and Data


Title:
MICROMACHINED STRAIN SENSOR
Document Type and Number:
WIPO Patent Application WO2000028277
Kind Code:
A3
Abstract:
A micromachined strain sensor to be incorporated in a sealed package with other microelectrical and micromechanical components, with the residual strain being monitored electronically from outside the package to allow strain to be monitored during production and during the life of the component. The strain sensor includes at least one microstructural beam member anchored to a substrate at one position and having a portion which is freed from the substrate during formation to displace as a result of the strain in the beam member. At least one electrically conductive displaceable tine is connected to the beam member to be displaced as it is freed. A mating electrically conductive tine is mounted to the substrate adjacent to the displaceable tine such that a capacitor is formed between the adjacent tines.

Inventors:
GIANCHANDANI YOGESH B
Application Number:
PCT/US1999/025913
Publication Date:
August 17, 2000
Filing Date:
November 03, 1999
Export Citation:
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Assignee:
WISCONSIN ALUMNI RES FOUND (US)
International Classes:
G01B7/16; G01L5/00; (IPC1-7): G01B7/16; G01L5/00
Domestic Patent References:
WO1996005492A11996-02-22
Foreign References:
US5786621A1998-07-28
US5610335A1997-03-11
Other References:
GIANCHANDANI Y B ET AL: "BENT-BEAM STRAIN SENSORS", JOURNAL OF MICROELECTROMECHANICAL SYSTEMS,US,IEEE INC. NEW YORK, vol. 5, no. 1, 1 March 1996 (1996-03-01), pages 52 - 58, XP000591377, ISSN: 1057-7157
LIWEI LIN ET AL: "A PASSIVE, IN SITU MICRO STRAIN GAUGE", PROCEEDINGS OF THE WORKSHOP ON MICRO ELECTRO MECHANICAL SYSTEMS (MEMS),US,NEW YORK, IEEE, vol. WORKSHOP 6, 1993, pages 201 - 206, XP000366881, ISBN: 0-7803-0957-X
ELBRECHT L ET AL: "Highly phosphorus-doped polysilicon films with low tensile stress for surface micromachining using POCl3 diffusion doping", SENSORS AND ACTUATORS A,CH,ELSEVIER SEQUOIA S.A., LAUSANNE, vol. 61, no. 1-3, 1 June 1997 (1997-06-01), pages 374 - 378, XP004092253, ISSN: 0924-4247
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