Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
MICROMACHINING METHOD, DIE MANUFACTURING METHOD, AND MICROMACHINING APPARATUS
Document Type and Number:
WIPO Patent Application WO/2017/213026
Kind Code:
A1
Abstract:
[Problem] To provide a micromachining method, a die manufacturing method, and a micromachining apparatus with which micromachining can be performed on the surface of a workpiece at high speed and with high precision. [Solution] A micromachining apparatus 100 comprising a cutting edge 110 and an oscillation unit 120 for oscillating the cutting edge 110 in a first direction K1 is used. The angle θ formed between the average cutting direction J1 of the cutting edge 110 and the first direction K1 is made to be in the range of 20° to 120°. Recesses and protrusions are machined in the surface of a workpiece WP1 as a result of the cutting edge 110 oscillating in the first direction K1.

Inventors:
SHAMOTO EIJI (JP)
SAITO HIROSHI (JP)
KOBAYASHI TSUNEYUKI (JP)
MOCHIZUKI MANABU (JP)
SAWAMURA KAZUMI (JP)
Application Number:
PCT/JP2017/020509
Publication Date:
December 14, 2017
Filing Date:
June 01, 2017
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
UNIV NAGOYA NAT UNIV CORP (JP)
YAMAGATA PREFECTURAL GOVERNMENT (JP)
SUGA ZOUKEI KOGYO INC (JP)
IMUZAK INC (JP)
International Classes:
B23B1/00; B29C33/38
Foreign References:
JPS58143901A1983-08-26
JP2009255275A2009-11-05
JPS4728267A
JP2005046943A2005-02-24
Other References:
See also references of EP 3466572A4
Attorney, Agent or Firm:
FUJITANI Osamu et al. (JP)
Download PDF: