Title:
MICROMECHANICAL COMPONENT AND METHOD FOR PRODUCING THE SAME
Document Type and Number:
WIPO Patent Application WO2001087765
Kind Code:
A3
Abstract:
The invention relates to a micromechanical component that comprises a substrate (1); a movable sensor structure (6) in a first micromechanical functional layer (5) disposed above said substrate; a first closing layer (8) on the first micromechanical functional layer (5), which is at least partially structured; a second micromechanical functional layer (10) on the first closing layer (8), which has at least one covering function and which is at least partially anchored in the first micromechanical functional layer (5); and a second closing layer (8) on the second micromechanical functional layer (10). The sensor structure (6) is provided with trenches (7) the width of which is not larger than a maximum trench width (66) that can be closed by the first closing layer (8) in the form of plugs (9) that do not reach the trench bottoms.
Inventors:
LUTZ MARKUS (US)
Application Number:
PCT/DE2001/001073
Publication Date:
January 16, 2003
Filing Date:
March 21, 2001
Export Citation:
Assignee:
BOSCH GMBH ROBERT (DE)
LUTZ MARKUS (US)
LUTZ MARKUS (US)
International Classes:
B81C1/00; B81B3/00; B81B7/00; G01P1/02; G01P15/08; G01P15/125; (IPC1-7): G01P15/08; B81B3/00; B81B7/00; B81C1/00; G01P1/02
Foreign References:
| DE10017422A1 | 2001-10-11 | |||
| DE4332843A1 | 1995-04-20 | |||
| DE19537814A1 | 1997-04-17 |
Other References:
KNIFFIN M L ET AL: "PACKAGING FOR SILICON MICROMACHINED ACCELEROMETERS", INTERNATIONAL JOURNAL OF MICROCIRCUITS AND ELECTRONIC PACKAGING, INTERNATIONAL MICROELECTRONICS & PACKAGING SOCIETY, US, vol. 19, no. 1, 1996, pages 75 - 86, XP000639470, ISSN: 1063-1674
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