MICRONEEDLE ARRAY UNIT

WIPO Patent Application WO/2020/090846

A1

The present invention addresses the problem of providing a microneedle array unit which is reduced in size and which can pierce the skin when pressed with a finger. According to the present invention, provided is a microneedle array unit provided with: a microneedle array having a sheet part and a plurality of needle parts arranged inside the outer peripheral surface of one surface of the sheet part; a container storing the microneedle array and having a storage part that has an opening and a projection section supporting the outer peripheral surface of the microneedle array, a deformation part that is disposed on a side opposite to the opening and is integrated with the storage part, a flange part that is integrated with the storage part and makes contact with the skin; a lid part that seals the opening of the container; and a piercing tool that is a solid body having two different area sizes at the top and bottom. By receiving an external force in the direction of the opening through the smaller area size of the two different area sizes at the top and bottom of the piercing tool, the deformation part is deformed and presses the other surface of the microneedle array. By the pressing from the deformation part, the microneedle array deforms the projection section and is pushed from the storage part to the outside. The deformation part maintains the state of being deformed, and presses the microneedle array.

YOSHIDA JUNYA (JP)
KABATA KOKI (JP)
KOBAYASHI YUKA (JP)

PCT/JP2019/042462

May 07, 2020

October 30, 2019

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FUJIFILM CORP (JP)

A61M37/00

WO2009107806A2

2009-09-03

JP2016131619A	2016-07-25
JP5553612B2	2014-07-16
US20090198189A1	2009-08-06
JP2018191783A	2018-12-06
JP5553612B2	2014-07-16

See also references of EP 3875140A4

SIKs & Co. (JP)

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