Title:
MICRONEEDLE PATCH, AND METHOD AND DEVICE FOR MANUFACTURING MICRONEEDLE
Document Type and Number:
WIPO Patent Application WO/2018/079990
Kind Code:
A1
Abstract:
According to various embodiments of the disclosure, a microneedle patch comprises: microneedles including a viscous composition; an adhesive sheet adhered to the skin; and a base sheet having the microneedles arranged thereon, wherein the shape of the microneedles has a spirally-twisted screw shape so as to have a first incline facing a first direction and a second incline facing a second direction, which is the direction opposite to the first direction, and the diameter of a base part facing the base sheet gradually decreases toward an end portion.
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Inventors:
KIM MOO-RIM (KR)
LEE JEONG-GUN (KR)
CHO SHIN-HEE (KR)
LEE JEONG-GUN (KR)
CHO SHIN-HEE (KR)
Application Number:
PCT/KR2017/008591
Publication Date:
May 03, 2018
Filing Date:
August 09, 2017
Export Citation:
Assignee:
SAMSUNG ELECTRONICS CO LTD (KR)
International Classes:
A61M37/00; A61L31/10
Domestic Patent References:
| WO2011093674A2 | 2011-08-04 |
Foreign References:
| KR20140131879A | 2014-11-14 | |||
| KR101549086B1 | 2015-09-02 | |||
| KR20120068516A | 2012-06-27 | |||
| US20110237925A1 | 2011-09-29 |
Attorney, Agent or Firm:
KIM, Tae-hun et al. (KR)
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