Title:
MICRONEEDLE PATCH
Document Type and Number:
WIPO Patent Application WO/2023/042525
Kind Code:
A1
Abstract:
A microneedle structure 10 of the present invention comprises: a liquid-impermeable substrate 11 that has a through-hole 15; a liquid-absorbable absorbent material 16 that is filled into the through-hole 15; needle-shaped parts 12 that are provided on one surface side of the substrate 11 and have a flow channel formed in the interior thereof; and a functional member 21 that is provided on the other surface side of the substrate 11. The needle-shaped parts 12 are connected to the absorbent material 16, and the absorbent material 16 is connected to the functional member 21.
Inventors:
KOMA YOSUKE (JP)
KIM BEOMJOON (JP)
PARK JONGHO (JP)
KIM BEOMJOON (JP)
PARK JONGHO (JP)
Application Number:
PCT/JP2022/026226
Publication Date:
March 23, 2023
Filing Date:
June 30, 2022
Export Citation:
Assignee:
LINTEC CORP (JP)
UNIV TOKYO (JP)
UNIV TOKYO (JP)
International Classes:
A61M37/00; A61B5/145; A61B5/15
Domestic Patent References:
| WO2019176126A1 | 2019-09-19 |
Foreign References:
| JP2002532165A | 2002-10-02 | |||
| JP2005514179A | 2005-05-19 | |||
| JP2003038467A | 2003-02-12 | |||
| JP2012509138A | 2012-04-19 | |||
| JP2017000724A | 2017-01-05 |
Attorney, Agent or Firm:
HAYAKAWA Yuzi et al. (JP)
Download PDF:
Previous Patent: SEALANT MATERIAL COMPOSITION AND TIRE OBTAINED USING SAME
Next Patent: COLLECTOR, ORE FLOTATION METHOD, AND COMPOUND
Next Patent: COLLECTOR, ORE FLOTATION METHOD, AND COMPOUND