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Patent Searching and Data


Title:
MICROSTRIP LINE AND MANUFACTURING METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/1993/002485
Kind Code:
A1
Abstract:
A microstrip line capable of feeding a large DC current, in spite of maintaining a high characteristic impedance. The microstrip line is provided with a dielectric base (10), an earthing conductor (12), a conductor strip (14), and an upper conductor part (16). The upper conductor part (16) is provided nearly on the central line of the conductor strip (14), and has a section which is thick in a vertical direction and whose width w1 of the lower base (16a) is narrower than the width W of the conductor strip (14) and respective width w2 from the base (16a) to its opposite side (16b) are nearly equal to the width w1 of the base (16a) or become larger than the width w1 at upper parts. The upper conductor part (16) of such sectional shape is formed by welding onto the conductor strip (14) a linear member made of gold, silver or copper whose section is shaped so through etching, or by depositing on the conductor strip (14) gold, silver or copper through plating.

Inventors:
TOZAWA NORIO (JP)
Application Number:
PCT/JP1992/000913
Publication Date:
February 04, 1993
Filing Date:
July 17, 1992
Export Citation:
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Assignee:
FUJITSU LTD (JP)
International Classes:
H01P3/08; H05K1/02; H05K3/24; H05K3/40; (IPC1-7): H01P3/08; H01P11/00
Foreign References:
JPS5836841B21983-08-12
JPS6122330Y21986-07-04
JPS6033705A1985-02-21
JPH01158801A1989-06-21
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