Title:
MICROWAVE DEVICE AND ANTENNA
Document Type and Number:
WIPO Patent Application WO/2018/168391
Kind Code:
A1
Abstract:
This microwave device (100) is provided with: a multilayer resin substrate (1) which is a first multilayer resin substrate; an IC (6) which is a high-frequency circuit that is provided on the multilayer resin substrate (1) and is electrically connected to the multilayer resin substrate (1); a heat spreader (7) which is arranged on a surface of the IC (6), said surface being on the reverse side of the multilayer resin substrate (1)-side surface, and which is in contact with the IC (6); a mold resin (50) which covers the peripheries of the heat spreader (7) and the IC (6); and a conductive film (2) which covers the mold resin (50) and the heat spreader. The inner side of the conductive film (2) is in contact with the heat spreader (7); and the conductive film (2) is electrically connected to a ground via hole (11) of the multilayer resin substrate (1).
Inventors:
TARUI YUKINOBU (JP)
KIMURA MAKOTO (JP)
MIYAWAKI KATSUMI (JP)
ISHIDA KIYOSHI (JP)
MATSUOKA HIROAKI (JP)
KIMURA MAKOTO (JP)
MIYAWAKI KATSUMI (JP)
ISHIDA KIYOSHI (JP)
MATSUOKA HIROAKI (JP)
Application Number:
PCT/JP2018/006578
Publication Date:
September 20, 2018
Filing Date:
February 22, 2018
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP (JP)
International Classes:
H01L23/12; H01L23/00; H01L23/28; H01L23/29; H01L23/36; H01Q21/06; H01Q23/00
Domestic Patent References:
| WO2016117196A1 | 2016-07-28 |
Foreign References:
| JP2008515189A | 2008-05-08 | |||
| JP2002138205A | 2002-05-14 | |||
| JP2011216806A | 2011-10-27 |
Attorney, Agent or Firm:
TAKAMURA, Jun (JP)
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