Title:
MICROWAVE PROCESSING DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/009174
Kind Code:
A1
Abstract:
This microwave processing device includes a processing chamber, a microwave supply unit, and a resonance unit. The processing chamber is surrounded by a plurality of wall surfaces and houses an object to be heated. The microwave supply unit supplies microwaves to the processing chamber. The resonance unit is provided on one wall surface of the plurality of wall surfaces and has a resonance frequency in the frequency band of the microwaves. According to this aspect, it is possible to change the impedance on the surface of the resonance unit by controlling a frequency supplied to the processing chamber. By doing so, it is possible to control the standing wave distribution in the processing chamber, i.e., the microwave energy distribution in the processing chamber. As a result, in the case where a plurality of objects to be heated are heated at the same time, it is possible to perform desired dielectric heating on each object to be heated.
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Inventors:
YOSHINO KOJI
KUBO MASAYUKI
HASHIMOTO OSAMU
SUGA RYOSUKE
KUBO MASAYUKI
HASHIMOTO OSAMU
SUGA RYOSUKE
Application Number:
PCT/JP2018/024538
Publication Date:
January 10, 2019
Filing Date:
June 28, 2018
Export Citation:
Assignee:
PANASONIC CORP (JP)
International Classes:
H05B6/64; H05B6/74
Domestic Patent References:
| WO2017081855A1 | 2017-05-18 | |||
| WO2015173601A1 | 2015-11-19 |
Foreign References:
| JP2003529261A | 2003-09-30 |
Other References:
See also references of EP 3651552A4
Attorney, Agent or Firm:
TOKUDA Yoshiaki et al. (JP)
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