Title:
MIXED-ABRASIVE POLISHING COMPOSITION AND METHOD FOR USING THE SAME
Document Type and Number:
WIPO Patent Application WO2004072199
Kind Code:
A3
Abstract:
The invention provides a polishing composition comprising (i) an abrasive comprising (a) 5 to 45 wt.% of first abrasive particles having a Mohs hardness of 8 or more, (b) 1 to 45 wt.% of second abrasive particles having a three-dimensional structure comprising aggregates of smaller primary particles, and (c) 10 to 90 wt.% of third abrasive particles comprising silica, and (ii) a liquid carrier. The invention also provides a method of polishing a substrate, which method comprises the steps of (i) providing the above-described polishing composition, (ii) providing a substrate having a surface, and (iii) abrading at least a portion of the substrate surface with the polishing composition to polish the substrate.
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| JP2002164307 | COMPOSITION FOR POLISHING, AND POLISHING METHOD USING THE COMPOSITION |
| WO/2016/035250 | METHOD FOR MANUFACTURING POLISHING COMPOSITION |
| WO/1999/023189 | ABRASIVE PARTICLES FOR SURFACE POLISHING |
Inventors:
CHANEYALEW ATENAFU N
SUN TAO
SUN TAO
Application Number:
PCT/US2004/003053
Publication Date:
December 02, 2004
Filing Date:
February 04, 2004
Export Citation:
Assignee:
CABOT MICROELECTRONICS CORP (US)
International Classes:
C09G1/02; C09K3/14; (IPC1-7): C09G1/02; C09K3/14; H01L21/321; H01L21/768
Domestic Patent References:
| WO1993022103A1 | 1993-11-11 |
Foreign References:
| US20020023389A1 | 2002-02-28 | |||
| EP0786504A1 | ||||
| US6293848B1 | 2001-09-25 | |||
| GB1443638A | 1976-07-21 |
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