MOBILE DEVICE, EXPOSURE DEVICE, EXPOSURE METHOD, MICRO-MOTION BODY, AND DEVICE MANUFACTURING METHOD

Title:

MOBILE DEVICE, EXPOSURE DEVICE, EXPOSURE METHOD, MICRO-MOTION BODY, AND DEVICE MANUFACTURING METHOD

Document Type and Number:

WIPO Patent Application WO/2007/113955

Kind Code:

A1

Abstract:

Since power transmission/waste heat frames (24A, 24B) can always absorb heat radiated from wafer stages (WST1, WST2), it is possible to suppress affect of heat generated in the wafer stages (WST1, WST2) to an exposure accuracy. In this case, there is no need of connecting an external tube for supplying a coolant to the wafer stages (WST1, WST2) as in the prior art. Accordingly, it is possible to prevent lowering of the motion accuracy of the wafer stages (WST1, WST2) by the tension of the tube, which in turn maintains a high exposure accuracy.

Inventors:

TANAKA KEIICHI (JP)

Application Number:

PCT/JP2007/053723

Publication Date:

October 11, 2007

Filing Date:

February 28, 2007

Export Citation:

Click for automatic bibliography generation Help

Assignee:

NIKON CORP (JP)
TANAKA KEIICHI (JP)

International Classes:

H01L21/027; H01L21/68

Domestic Patent References:

WO2004053955A1	2004-06-24
WO2005074014A1	2005-08-11
WO2001035168A1	2001-05-17

Foreign References:

JP2003058258A	2003-02-28
JP2005209997A	2005-08-04
JPH07270122A	1995-10-20
JP2005277030A	2005-10-06
JP2003229347A	2003-08-15
JPH11214482A	1999-08-06
JP2004311780A	2004-11-04
JP2003068626A	2003-03-07
JPH06283403A	1994-10-07
US5448332A	1995-09-05
JPH0559660B2	1993-08-31
JPS58115945A	1983-07-09
JPS6144429A	1986-03-04
US6778257B2	2004-08-17
JP2004519850A	2004-07-02
US6611316B2	2003-08-26

Other References: