Title:
MODIFICATION METHOD FOR POLYPHENYL ETHER RESIN, LAMINATED FILM COMPOSITE MATERIAL, LAMINATED FILM, AND SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2024/027191
Kind Code:
A1
Abstract:
Provided in the present disclosure are a modification method for a polyphenyl ether resin, a laminated film composite material, a laminated film, and a substrate. The modification method for a polyphenyl ether resin involves the use of an indene oligomer for the modification of a polyphenyl ether to reduce the molecular weight of the polyphenyl ether, so as to obtain an indene oligomer modified polyphenyl ether resin. The modified polyphenyl ether with a relatively small molecular weight has a lower softening point and melting point and a better interface adhesive force, can be better attached to a substrate of an integrated circuit, and can also reduce the dielectric constant and dielectric loss of the substrate due to the relatively low dielectric constant and dielectric loss thereof, thereby solving the technical problems of electric leakage and heat generation caused by reduction in the feature size of an integrated circuit when existing polyphenyl ether resins are used in the integrated circuit.
Inventors:
WU DE (CN)
WANG YI (CN)
LIAO SHUHANG (CN)
SU JUNXING (CN)
WANG YI (CN)
LIAO SHUHANG (CN)
SU JUNXING (CN)
Application Number:
PCT/CN2023/087230
Publication Date:
February 08, 2024
Filing Date:
April 10, 2023
Export Citation:
Assignee:
WUHAN CHOICE TECH CO LTD (CN)
International Classes:
C08G65/48; B32B27/06; B32B27/36; B32B33/00; B32B37/00; C08J5/18; C08K7/18; C08L63/00; C08L71/12; H05K1/03
Domestic Patent References:
| WO2014104742A1 | 2014-07-03 |
Foreign References:
| CN114989418A | 2022-09-02 | |||
| JPH09291148A | 1997-11-11 | |||
| CN111315820A | 2020-06-19 | |||
| CN113897163A | 2022-01-07 | |||
| JP2009029923A | 2009-02-12 | |||
| JP2009029928A | 2009-02-12 |
Other References:
HUUB A. M. VAN AERT ET AL.: "Modified poly(2,6-dimethyl-1,4-phenylene ether)s prepared by redistribution", MACROMOLECULES, vol. 30, no. 20, 6 October 1997 (1997-10-06), pages 6056 - 6066, XP000702260, ISSN: 0024-9297, DOI: 10.1021/ma970388r
CHEN WEN-JINGļ¼, LI ZHONG-LUN, ZOU HUA-WEI, LIU PENG-BO: "Modification of epoxy resin by redistribution product of polyphenylene oxide with maleic anhydride", THERMOSETTING RESIN, vol. 30, no. 1, 30 January 2015 (2015-01-30), pages 1 - 4, 12, XP093135268, DOI: 10.13650/j.cnki.rgxsz.2015.01.001
CHEN WEN-JINGļ¼, LI ZHONG-LUN, ZOU HUA-WEI, LIU PENG-BO: "Modification of epoxy resin by redistribution product of polyphenylene oxide with maleic anhydride", THERMOSETTING RESIN, vol. 30, no. 1, 30 January 2015 (2015-01-30), pages 1 - 4, 12, XP093135268, DOI: 10.13650/j.cnki.rgxsz.2015.01.001
Attorney, Agent or Firm:
BEIJING ZHONGDA DEQUAN IP AGENCY CO., LTD. (CN)
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