Title:
MODIFIED BISMALEIMIDE PREPOLYMER, RESIN COMPOSITION, AND APPLICATION OF RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2024/077886
Kind Code:
A1
Abstract:
The present invention provides a modified bismaleimide prepolymer, which is prepared by reacting a bismaleimide compound, a double-bond-containing organic silicone resin and a hydrocarbon resin, wherein the ratio of the mass of the bismaleimide compound to the mass of the double-bond-containing organic silicone resin to the mass of the hydrocarbon resin is 100:(3-40):(5-50). In the invention, introducing a silicon-oxygen bond and a carbon-hydrogen bond into the bismaleimide compound, and controlling the mass ratio of the bismaleimide compound, the double-bond-containing organic silicone resin and the hydrocarbon resin, improves the pre-polymerization process, and improves the toughness and the dielectric properties of a bismaleimide compound curing system.
Inventors:
CHEN XIANGXIU (CN)
JIAO FENG (CN)
WANG HUI (CN)
CUI CHUNMEI (CN)
MA JIAN (CN)
JIAO FENG (CN)
WANG HUI (CN)
CUI CHUNMEI (CN)
MA JIAN (CN)
Application Number:
PCT/CN2023/085348
Publication Date:
April 18, 2024
Filing Date:
March 31, 2023
Export Citation:
Assignee:
SHENGYI TECH SUZHOU CO LTD (CN)
SHENGYI TECH CHANGSHU CO LTD (CN)
SHENGYI TECH CHANGSHU CO LTD (CN)
International Classes:
C08F299/08; C08F299/00; C08F299/02; C08J5/24; C08K7/14; C08L53/00
Attorney, Agent or Firm:
SUZHOU WISPRO INTELLECTUAL PROPERTY AGENCY (CN)
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