MODIFIER FOR RESIN AND RESIN COMPOSITION USING THE SAME AND FORMED ARTICLE

Title:

MODIFIER FOR RESIN AND RESIN COMPOSITION USING THE SAME AND FORMED ARTICLE

Document Type and Number:

WIPO Patent Application WO/2005/078013

Kind Code:

A1

Abstract:

A modifier for a resin which has an average particle diameter of 20 μm or more, wherein particles having a particle diameter of 10 μm or less account for less than 30 mass % of the modifier, and wherein after the modifier is irradiated with a ultrasonic wave of 40 w for five minutes, particles having a particle diameter of 10 μm or less account for 30 mass % or more of the modifier; a resin composition which comprises 1 to 40 mass % of the above modifier for a resin and 99 to 60 mass % of a thermoplastic resin or a thermosetting resin the sum of the amounts of the both components is 100 mass %; and a formed article produced by forming the resin composition.

Inventors:

WAKITA TSUNEKI (JP)
NAKAMURA KEIJI (JP)
MAKINO HIDEAKI (JP)
OSUKA MASAHIRO (JP)
MIWA YOHEI (JP)
DOI YASUTAKA (JP)

Application Number:

PCT/JP2005/002210

Publication Date:

August 25, 2005

Filing Date:

February 15, 2005

Export Citation:

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Assignee:

MITSUBISHI RAYON CO (JP)
WAKITA TSUNEKI (JP)
NAKAMURA KEIJI (JP)
MAKINO HIDEAKI (JP)
OSUKA MASAHIRO (JP)
MIWA YOHEI (JP)
DOI YASUTAKA (JP)

International Classes:

C08F265/04; C08F279/02; C08F283/12; C08J3/12; C08K5/00; C08L33/04; C08L51/00; C08L51/04; C08L51/08; C08L101/00; H01L23/29; (IPC1-7): C08K5/00; C08L101/00; C08J3/12; H01L23/29

Domestic Patent References:

WO2000001748A1	2000-01-13
WO2001088021A1	2001-11-22

Foreign References:

JPS641731A	1989-01-06
JPH1135873A	1999-02-09
JPS6222825A	1987-01-31
JP2000007890A	2000-01-11
JP2003002978A	2003-01-08
JP2004231916A	2004-08-19
JP2000007890A	2000-01-11
EP0985692A2	2000-03-15

Other References: