Title:
MODULAR ENCAPSULATION STRUCTURE AND METHOD
Document Type and Number:
WIPO Patent Application WO/2022/037037
Kind Code:
A1
Abstract:
Provided are a modular encapsulation structure and method. The modular encapsulation structure comprises: at least one first module which is arranged in a stacked manner, with each first module comprising a first chip and a second chip, which are arranged facing away from each other, wherein the first chip is electrically led out to a first surface and/or a second surface of the first module, and the second chip is electrically led out to the first surface and/or the second surface of the first module; and a second module, which is connected to the first module in an attachment manner, wherein the second module comprises a third chip, and the third chip is electrically led out to a first surface and/or a second surface of the second module. The second module is electrically connected to the first module.
Inventors:
CAO LIQIANG (CN)
ZHANG KAI (CN)
GENG FEI (CN)
ZHANG KAI (CN)
GENG FEI (CN)
Application Number:
PCT/CN2021/079251
Publication Date:
February 24, 2022
Filing Date:
March 05, 2021
Export Citation:
Assignee:
NAT CENTER FOR ADVANCED PACKAGING CO LTD (CN)
SHANGHAI XIANFANG SEMICONDUCTOR CO LTD (CN)
SHANGHAI XIANFANG SEMICONDUCTOR CO LTD (CN)
International Classes:
H01L25/16; H01L23/367; H01L21/50
Foreign References:
| CN111900155A | 2020-11-06 | |||
| CN101599482A | 2009-12-09 | |||
| CN101615609A | 2009-12-30 | |||
| US6845184B1 | 2005-01-18 | |||
| CN1283871A | 2001-02-14 |
Attorney, Agent or Firm:
SHANGHAI ZHISHENG INTELLECTUAL PROPERTY OFFICE (CN)
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