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Patent Searching and Data


Title:
MODULAR HEAD LAMINATION DEVICE AND METHOD
Document Type and Number:
WIPO Patent Application WO2006088851
Kind Code:
A8
Abstract:
A composite item is fabricated with a device. The device includes and end effector and a positioning device. The end effector places a tow. The end effector includes a spindle, compaction device, and a path. The spindle detachably secures a spool of tow and the path is disposed from the spool to the compaction device. The positioning device positions the end effector. The end effector is detachably secured to the positioning device.

Inventors:
WAMPLER ROBERT R (US)
KISCH ROBERT A (US)
LUM MATTHEW K (US)
KRAMP ROBERT A (US)
Application Number:
PCT/US2006/005144
Publication Date:
April 17, 2008
Filing Date:
February 14, 2006
Export Citation:
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Assignee:
BOEING CO (US)
WAMPLER ROBERT R (US)
KISCH ROBERT A (US)
LUM MATTHEW K (US)
KRAMP ROBERT A (US)
International Classes:
B29C70/38
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