Title:
MODULAR RELAY STRUCTURE HAVING HIGH UNIVERSALITY AND HIGH COMPATIBILITY FOR PARTS
Document Type and Number:
WIPO Patent Application WO/2024/046334
Kind Code:
A1
Abstract:
Disclosed in the present invention is a modular relay structure having high universality and high compatibility for parts. Firstly, an iron core assembly can attract an armature after being powered on, and under the driving action of an elastic hook, the armature moves in an axial direction of the iron core assembly so as to be reset, that is, the armature moves in the axial direction of the iron core assembly when being attracted or bounced off, and thus can push a push card to move in the axial direction of the iron core assembly; secondly, an NC terminal, a movable contact spring and an NO terminal are sequentially distributed in the axial direction of the iron core assembly, such that the push card can, when pushing the movable contact spring to move along the iron core assembly, be in contact with the NC terminal and the NO terminal, so as to complete the conversion of the path; and furthermore, on the basis of an electrical contact structure, a hollow insulating cover of a driving mechanism is detachably connected to a bottom plate of a load mechanism, and only the load mechanism needs to be replaced for different models, such that the driving mechanism can adapt to each replaced load mechanism, and other components are not affected. As a result, the compatibility of the present relay is higher, thereby facilitating production management.
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Inventors:
ZONG BIN (CN)
Application Number:
PCT/CN2023/115626
Publication Date:
March 07, 2024
Filing Date:
August 30, 2023
Export Citation:
Assignee:
MINGGUANG XINDA ELECTRONICS CO LTD (CN)
International Classes:
H01H50/18; H01H50/54; H01H50/56
Foreign References:
| CN202650990U | 2013-01-02 | |||
| CN111668070A | 2020-09-15 | |||
| CN215069822U | 2021-12-07 | |||
| JP2002216605A | 2002-08-02 | |||
| CN115458372A | 2022-12-09 |
Attorney, Agent or Firm:
BEIJING GAOWO LAW FIRM (CN)
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