Title:
MODULE, LAMINATE FOR IMAGE DISPLAY DEVICE, IMAGE DISPLAY DEVICE, MODULE MANUFACTURING METHOD, AND WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2023/080252
Kind Code:
A1
Abstract:
This module comprises: a wiring board including a board, a mesh wiring layer, a feed portion, and a protection layer; and a feed line electrically connected to the feed portion via an anisotropically conductive film including electrically conductive particles. The board has transparency. The protection layer only covers a part of the feed portion. The anisotropically conductive film covers regions of the feed portion that are not covered by the protection layer.
Inventors:
FURUSHOU HIROKI (JP)
TAKE SEIJI (JP)
KINOSHITA KAZUKI (JP)
SAKAKI MASASHI (JP)
TAKE SEIJI (JP)
KINOSHITA KAZUKI (JP)
SAKAKI MASASHI (JP)
Application Number:
PCT/JP2022/041513
Publication Date:
May 11, 2023
Filing Date:
November 08, 2022
Export Citation:
Assignee:
DAINIPPON PRINTING CO LTD (JP)
International Classes:
H01Q1/22; G09F9/00; H01Q1/40; H01R11/01; H05K3/32
Domestic Patent References:
| WO2020226049A1 | 2020-11-12 |
Foreign References:
| JP2007039519A | 2007-02-15 | |||
| JPH07307179A | 1995-11-21 | |||
| US20200243959A1 | 2020-07-30 | |||
| JP2008124387A | 2008-05-29 | |||
| JP2014006865A | 2014-01-16 | |||
| JP2019050016A | 2019-03-28 |
Attorney, Agent or Firm:
MIYAJIMA Manabu et al. (JP)
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