Title:
MODULE AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2021/192739
Kind Code:
A1
Abstract:
A module (101) comprises a substrate (1) having a first surface (1a) and one or more recesses (4) in the first surface (1a), and an electronic component (3a) mounted on the first surface (1a). The electronic component (3a) is connected to the substrate (1) via a plurality of bumps (19). All of the plurality of bumps (19) are connected to the first surface (1a) in any of the one or more recesses (4). The height of the plurality of bumps (19) is greater than the depth of the one or more recesses (4). When viewed from a direction perpendicular to the first surface (1a), a part of the electronic component (3a) is disposed outside an outer periphery of a recess selected from the one or more recesses (4).
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Inventors:
HATASE MINORU (JP)
OTSUBO YOSHIHITO (JP)
OTSUBO YOSHIHITO (JP)
Application Number:
PCT/JP2021/005814
Publication Date:
September 30, 2021
Filing Date:
February 17, 2021
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H01L25/00; H05K1/18; H05K3/28; H05K9/00
Domestic Patent References:
| WO2013035716A1 | 2013-03-14 | |||
| WO2018168709A1 | 2018-09-20 |
Foreign References:
| JP2006185989A | 2006-07-13 | |||
| JP2004356195A | 2004-12-16 | |||
| JP2013074289A | 2013-04-22 | |||
| JP2012015172A | 2012-01-19 | |||
| JP2009267421A | 2009-11-12 | |||
| JP2007142210A | 2007-06-07 |
Attorney, Agent or Firm:
FUKAMI PATENT OFFICE, P.C. (JP)
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