Title:
MODULE
Document Type and Number:
WIPO Patent Application WO/2018/164160
Kind Code:
A1
Abstract:
Provided is a module which is capable of achieving reduction in height, while improving heat dissipation effect. A module 1 according to the present invention is provided with: a substrate 2; a first component 3 which generates heat, while being mounted on one main surface 2a of the substrate 2; a second component 4 which is mounted on the main surface 2a of the substrate 2, and wherein the temperature increase during operation is smaller than the temperature increase of the first component 3 during operation; a metal block 6 which is connected to an opposite surface 3a of the first component 3, said opposite surface being on the reverse side of a facing surface that faces the main surface 2a, and to an opposite surface 4a of the second component 4, said opposite surface being on the reverse side of a facing surface that faces the main surface 2a; and a sealing resin layer 7 which seals the main surface 2a, the first component 3, the second component 4 and the metal block 6. The height from the main surface 2a to the highest surface 8a of the metal block 6 is lower than the height from the main surface 2a to the highest surface 7a of the sealing resin layer 7.
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Inventors:
MORIMOTO YUTA (JP)
NOMURA TADASHI (JP)
KUSUNOKI MOTOHIKO (JP)
KOMATSU TORU (JP)
NOMURA TADASHI (JP)
KUSUNOKI MOTOHIKO (JP)
KOMATSU TORU (JP)
Application Number:
PCT/JP2018/008682
Publication Date:
September 13, 2018
Filing Date:
March 07, 2018
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H01L23/29; H01L23/12; H01L23/31; H01L25/00; H01L25/07; H01L25/18
Domestic Patent References:
| WO2016117196A1 | 2016-07-28 |
Foreign References:
| JP2007311441A | 2007-11-29 | |||
| JP2001244391A | 2001-09-07 | |||
| JP2016134591A | 2016-07-25 | |||
| JP2014179611A | 2014-09-25 | |||
| JP2001267473A | 2001-09-28 |
Attorney, Agent or Firm:
YANASE, Yuji et al. (JP)
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