Title:
MODULE
Document Type and Number:
WIPO Patent Application WO/2021/049521
Kind Code:
A1
Abstract:
A module (101) is provided with: a substrate (1) having a first major surface (1a); a first component (3a) mounted on the first major surface (1a); a first seal resin (6a) covering the first major surface (1a) and at least a part of the first component (3a) that is connected to the first major surface; a first conductor pattern (21) disposed on a surface of the first seal resin (6a) on a side farther from the first major surface (1a); and a columnar conductor (14) which, as a metal member, extends from an electrode (13), drawn from the first component (3a) along the first major surface (1a), and is connected to the first conductor pattern (21) through the first seal resin (6a).
Inventors:
OTSUBO YOSHIHITO (JP)
KATAOKA YUJI (JP)
KATAOKA YUJI (JP)
Application Number:
PCT/JP2020/034090
Publication Date:
March 18, 2021
Filing Date:
September 09, 2020
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H01L23/00; H01L23/12; H01L23/28; H01L25/04; H01L25/18; H05K1/02; H05K9/00
Domestic Patent References:
| WO2018110397A1 | 2018-06-21 | |||
| WO2019138895A1 | 2019-07-18 | |||
| WO2018164158A1 | 2018-09-13 |
Foreign References:
| JPH0458596A | 1992-02-25 |
Attorney, Agent or Firm:
FUKAMI PATENT OFFICE, P.C. (JP)
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