Title:
MODULE
Document Type and Number:
WIPO Patent Application WO/2021/054017
Kind Code:
A1
Abstract:
A module (100) according to the present invention is provided with a substrate (110), a first component (120) and a first sealing resin layer (130). The substrate (110) has a first main surface (111). The first component (120) is mounted on the first main surface (111). The first sealing resin layer (130) contains a filler that is mainly composed of an inorganic oxide. The first sealing resin layer (130) is provided on the first main surface (111). The first sealing resin layer (130) seals the first component (120). A surface of the first sealing resin layer (130), said surface being on the reverse side from the substrate (110), is provided with a marking part (133). The content of the filler in the first sealing resin layer (130) is lower in a second portion that is on the reverse side from the substrate (110) than in a first portion that is on the substrate (110) side.
Inventors:
KOMATSU TORU (JP)
NOMURA TADASHI (JP)
NOMURA TADASHI (JP)
Application Number:
PCT/JP2020/031103
Publication Date:
March 25, 2021
Filing Date:
August 18, 2020
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H01L23/00; H01L23/28; H05K1/02; H05K3/28; H05K9/00
Domestic Patent References:
| WO2018116728A1 | 2018-06-28 | |||
| WO2019159913A1 | 2019-08-22 |
Foreign References:
| JP2000022052A | 2000-01-21 | |||
| JP2002353347A | 2002-12-06 | |||
| JP2001044304A | 2001-02-16 |
Attorney, Agent or Firm:
FUKAMI PATENT OFFICE, P.C. (JP)
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