Title:
MODULE
Document Type and Number:
WIPO Patent Application WO/2021/157368
Kind Code:
A1
Abstract:
A module (101) comprising: a substrate (1) having a first surface (1a) and a second surface (1b) that face each other; a component (3) mounted on the first surface (1a); a sealing resin (6) that covers the first surface (1a) and the component (3); a shield film (8) formed so as to cover the upper surface and side surfaces of the sealing resin (6), as well as the side surfaces of the substrate (1); and a resist film (5) formed so as to cover the second surface (1b). The resist film (5) has a plurality of projections.
Inventors:
NOMURA TADASHI (JP)
SATO TETSUO (JP)
SATO TETSUO (JP)
Application Number:
PCT/JP2021/001984
Publication Date:
August 12, 2021
Filing Date:
January 21, 2021
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H01L23/00; H01L23/12; H01L23/28; H05K3/28; H05K9/00
Domestic Patent References:
| WO2019111873A1 | 2019-06-13 |
Foreign References:
| JP2018093015A | 2018-06-14 | |||
| JP2010245931A | 2010-10-28 | |||
| JP2010177303A | 2010-08-12 | |||
| JP2002026198A | 2002-01-25 |
Attorney, Agent or Firm:
FUKAMI PATENT OFFICE, P.C. (JP)
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