Title:
MODULE
Document Type and Number:
WIPO Patent Application WO/2021/176871
Kind Code:
A1
Abstract:
A module (101) comprises a substrate (1) having a first surface (1a), a first component (31) mounted on the first surface (1a), a first sealing resin (6a) arranged to cover the first surface (1a) and the first component (31), a shield film (8) that covers at least the side surface of the first sealing resin (6a), a first ground terminal mounted on the first surface (1a), and a projecting part (15) formed so as to project laterally at any position in a direction perpendicular to the first surface (1a) of the first ground terminal. The projecting part (15) is electrically connected to a portion of the shield film (8) that covers the side surface of the first sealing resin (6a).
Inventors:
NOMURA TADASHI (JP)
NISHIKAWA HIROSHI (JP)
NISHIKAWA HIROSHI (JP)
Application Number:
PCT/JP2021/001987
Publication Date:
September 10, 2021
Filing Date:
January 21, 2021
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H01L23/00; H01L23/12; H01L23/28; H05K5/00; H05K9/00
Domestic Patent References:
| WO2018101384A1 | 2018-06-07 | |||
| WO2015194435A1 | 2015-12-23 |
Foreign References:
| JP2018098677A | 2018-06-21 | |||
| JP2018170419A | 2018-11-01 | |||
| JP2019021793A | 2019-02-07 |
Attorney, Agent or Firm:
FUKAMI PATENT OFFICE, P.C. (JP)
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