Title:
MODULE
Document Type and Number:
WIPO Patent Application WO/2022/038887
Kind Code:
A1
Abstract:
Provided is a module in which parasitic capacitance that is generated between two shield films has been reduced, without hindering the height reduction of the module. This module (1) comprises: a substrate (2); components (31, 32) that are mounted on an upper surface (2a) of the substrate which is one primary surface thereof; a first shield film (4) disposed on an upper surface (31a) and a side surface (31c) of the component (31); a sealing resin (5) disposed on the upper surface of the substrate so as to seal the components; and a second shield film (6) that is disposed on an upper surface (5a) of the sealing resin. A hole section (52), that reaches at least a portion of the first shield film, is disposed in the upper surface of the sealing resin. The second shield film, which is disposed in the hole section, makes contact with the first shield film at locations where the second shield film opposes the upper surface and the side surface of the component.
Inventors:
NOMURA TADASHI (JP)
OKABE RYOHEI (JP)
OKABE RYOHEI (JP)
Application Number:
PCT/JP2021/023405
Publication Date:
February 24, 2022
Filing Date:
June 21, 2021
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H01L23/00; H01L23/28; H01L25/16; H05K3/28; H05K9/00
Domestic Patent References:
| WO2019216299A1 | 2019-11-14 | |||
| WO2020021981A1 | 2020-01-30 | |||
| WO2009122835A1 | 2009-10-08 |
Foreign References:
| JP2008258478A | 2008-10-23 | |||
| JP2019149466A | 2019-09-05 |
Attorney, Agent or Firm:
YAMAO, Norihito et al. (JP)
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