Title:
MODULE
Document Type and Number:
WIPO Patent Application WO/2023/238537
Kind Code:
A1
Abstract:
A module (101) comprises: a core substrate (1) having a first surface (1a) and a second surface (1b) that form the front and back thereof, and a through-hole (1e) that connects the first surface (1a) and the second surface (1b); a redistribution layer (5) disposed so as to cover the first surface (1a) and the through-hole (1e) of the core substrate (1); a first component (41) at least partially disposed in the through-hole (1e); and a second component (42) mounted to the second surface (1b) side of the core substrate (1) so as to partially overlap the through-hole (1e). The first component (41) is electrically connected to the redistribution layer (5). The first component (41) is directly electrically connected to the second component (42) at a portion at which the second component (42) overlaps the through-hole (1e).
Inventors:
OTSUBO YOSHIHITO (JP)
Application Number:
PCT/JP2023/016269
Publication Date:
December 14, 2023
Filing Date:
April 25, 2023
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H01L25/00; H05K1/18; H05K3/46
Foreign References:
| JP2005197763A | 2005-07-21 | |||
| JP2016127290A | 2016-07-11 | |||
| JP2013004866A | 2013-01-07 |
Attorney, Agent or Firm:
FUKAMI PATENT OFFICE, P.C. (JP)
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