Title:
MOISTURE-CURABLE ADHESIVE COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2021/132523
Kind Code:
A1
Abstract:
A moisture-curable adhesive resin composition containing a moisture-curing resin (A) and a modified polyolefin resin (B), the content of the modified polyolefin resin (B) being 2 parts by mass or more with respect to 100 parts by mass of the moisture-curing resin (A). Provided is an adhesive composition containing a moisture-curing resin and a modified polyolefin, the adhesive composition having good liquidity and good adhesion to a polyolefin resin substrate.
Inventors:
SAKATA HIDEYUKI (JP)
KASHIHARA KENJI (JP)
KASHIHARA KENJI (JP)
Application Number:
PCT/JP2020/048595
Publication Date:
July 01, 2021
Filing Date:
December 24, 2020
Export Citation:
Assignee:
TOYO BOSEKI (JP)
International Classes:
C09J201/10; C09J4/02; C09J11/06; C09J123/26; C09J133/04; C09J171/00
Domestic Patent References:
| WO2019142716A1 | 2019-07-25 | |||
| WO2007142067A1 | 2007-12-13 |
Foreign References:
| JP2016094566A | 2016-05-26 | |||
| JP2005187793A | 2005-07-14 | |||
| JP2001206914A | 2001-07-31 |
Other References:
See also references of EP 4083160A4
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