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Title:
MOISTURE CURABLE RESIN COMPOSITION AND CURED PRODUCT
Document Type and Number:
WIPO Patent Application WO/2022/064931
Kind Code:
A1
Abstract:
[Problem] To provide a moisture curable resin composition which does not use an organic tin catalyst, has excellent quick curability and thick film curability due to moisture, and also has excellent adhesive properties to aluminum. [Solution] A moisture curable resin composition includes the following components (A) to (C): component (A) which is a polyoxyalkylene having hydrolyzable silyl groups at both ends thereof; component (B) which is a zinc-based catalyst; and component (C) which is a compound having, in one molecule, one hydrolyzable silyl group, and at least one amino group, wherein component (B) is contained in a predetermined amount with respect to 100 parts by mass of component (A).

Inventors:
HASHIMOTO TAKAHIRO (JP)
TANAKA MASAYUKI (JP)
Application Number:
PCT/JP2021/030929
Publication Date:
March 31, 2022
Filing Date:
August 24, 2021
Export Citation:
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Assignee:
THREE BOND CO LTD (JP)
International Classes:
C08L71/02; C08K5/5415; C08K5/544; C09J171/02; C09K3/10
Domestic Patent References:
WO2021119971A12021-06-24
Foreign References:
JP2016521787A2016-07-25
JP2014043519A2014-03-13
JP2010280880A2010-12-16
JP2009508985A2009-03-05
US20160244606A12016-08-25
JP2013147575A2013-08-01
JP2005054174A2005-03-03
JP2020161322A2020-10-01
Attorney, Agent or Firm:
HATTA & ASSOCIATES (JP)
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