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Title:
MOLD CLAMPING DEVICE, INJECTION MOLDING MACHINE, AND INJECTION MOLDING METHOD
Document Type and Number:
WIPO Patent Application WO/2006/115141
Kind Code:
A1
Abstract:
A mold clamping device usable for a mold having a cantilever-like side wall part and capable of effectively suppressing the deformation of the side wall part of the mold, an injection molding machine having the mold clamping device and capable of injection molding molded products of high quality without burrs, and an injection molding method. The mold clamping device comprises a side pusher having a pair of support bodies symmetrically disposed between two adjacent tie bars among a plurality of tie bars and slidably supported on the tie bars, a moving positioning means connecting the support bodies to either of a fixed platen and a movable platen and moving the support bodies to their prescribed positions and positioning them, and lateral clamping means installed on the pair of support bodies and pressing the side face of the fixed mold or the movable mold. The injection molding machine comprises the mold clamping device, and the injection molding method uses the mold clamping device.

Inventors:
MATSUSHITA HIROTO (JP)
TERAYAMA HIROSHI (JP)
KATOH NAOKI (JP)
SAKAMOTO AYUMI (JP)
YASUDA SHINJI (JP)
MORI SADAO (JP)
Application Number:
PCT/JP2006/308186
Publication Date:
November 02, 2006
Filing Date:
April 19, 2006
Export Citation:
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Assignee:
MITSUBISHI HEAVY IND PLASTIC T (JP)
HONDA MOTOR CO LTD (JP)
MATSUSHITA HIROTO (JP)
TERAYAMA HIROSHI (JP)
KATOH NAOKI (JP)
SAKAMOTO AYUMI (JP)
YASUDA SHINJI (JP)
MORI SADAO (JP)
International Classes:
B29C45/64; B22D17/26
Foreign References:
JP2587035Y21998-12-14
JPH08276436A1996-10-22
JPH0118339Y21989-05-29
Attorney, Agent or Firm:
Tanaka, Shigemitsu (20-9 Shiba 5-chome, Minato-k, Tokyo 14, JP)
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