Title:
MOLD CLAMPING DEVICE AND INJECTION MOLDING MACHINE
Document Type and Number:
WIPO Patent Application WO/2023/286504
Kind Code:
A1
Abstract:
The present invention pertains to a mold clamping device (2) that comprise: a stationary platen (5); a movable platen (7) which moves closer toward and away from the stationary platen (5); a rotary platen (4) which is provided to either one of the stationary platen (5) and the movable platen (7) so as to be attached with a die; and an extrusion device (10) which is provided to said one of the platens so as to extrude a molded article from the die. The rotary platen (4) is disposed on a surface of the one platen closer to the other platen so as to face the one platen and is provided to be rotatable via a bearing structure (36). The extrusion device (10) is disposed on a surface of the one platen at the side opposite to the other platen. The bearing structure (36) is configured to bear the rotary platen (4) at a position away from the rotational center in the radial direction, and the extrusion device (10) is provided with an ejector rod (37) that protrudes at the radially inner side as compared with the bearing structure (36).
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Inventors:
MITANI SOUMA (JP)
Application Number:
PCT/JP2022/023551
Publication Date:
January 19, 2023
Filing Date:
June 10, 2022
Export Citation:
Assignee:
JAPAN STEEL WORKS LTD (JP)
International Classes:
B29C45/16; B29C33/22; B29C33/44; B29C45/17; B29C45/40; B29C45/64
Foreign References:
| JP2020124891A | 2020-08-20 | |||
| JP2010023371A | 2010-02-04 | |||
| JP2009045939A | 2009-03-05 | |||
| JP2021117659A | 2021-08-10 |
Attorney, Agent or Firm:
EIKOH PATENT FIRM, P.C. (JP)
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