MOLD COOLING APPARATUS

WIPO Patent Application WO/2006/046292

A1

A mold cooling apparatus capable of cooling a mold by force-feeding a cooling water to cooling holes in the mold. A branch manifold (4) in which a plurality of distribution connection ports (4a), (4b), ... (4n) are formed is connected to the delivery side pipe (3) of a cooling water delivery pump (2) force-feeding the cooling water, connection joints (18a), (18b), ..., (18n) are inserted and connected to the distribution connection ports of the branch manifold so as to be extracted, branch pipe units (5a), (5b), ..., (5n) of the same quantity as that of cooling systems are threadedly connected detachably to the connection joints, and sealing caps (10a) and (10b) are threadedly connected to extra connection joints. One or a plurality of piston pumps are used as the cooling water delivery pumps, and all these cooling water delivery pumps are disposed so that water chambers (2a) discharging the cooling water are positioned on the lower side of pistons (36a). Accordingly, when the quantity of the cooling systems is increased or decreased, the assembly work for devices in a casing can be easily performed and even in the failure of a solenoid valve and the maintenance of devices, the work can be conveniently performed.

KOMAKI SHIGEYOSHI (JP)

PCT/JP2004/016004

May 04, 2006

October 28, 2004

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AHRESTY CORP (JP)
KOMAKI SHIGEYOSHI (JP)

B22C9/06; B22D17/22; B29C33/04; (IPC1-7): B29C33/04; B22C9/06; B22D17/22

JP3091865U	2003-02-21
JP2004204659A	2004-07-22
JPH1080758A	1998-03-31
JPH06315750A	1994-11-15

Hosoi, Sadayuki (14-7, Hakusan 5-chome, Bunkyo-k, Tokyo 01, JP)

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